MaskStudio
Fracturing system handling huge data and supporting multi formats that allows layout design data to be converted into various mask writing formats.
Fast Conversion Speed
MaskStudio's efficient parallel distributed processing mechanism can reduce the time it takes for conversion almost to the theoretical figure according to the increase in the parallel count. MaskStudio already has achieved good results with 200 parallel counts making it possible to handle data that will definitely become large in the future.Multi-format Support
The following file formats are supported.- (Input)
GDSII Version 5/ 6/ 7 OASIS 1.0 JEOL52 V1.0/ V2.1/ V3.0/ V3.1/ JOB MEBES RETICLE/ MODE5/JOB(*) Hitachi HL800/ HL900/ HL7000/ JOB Toshiba/NuFlare Tech. VSB11/ VSB12/ JOB LAVIS PILOT USER USER-Format
- (Output)
GDSII Version 7 OASIS 1.0 JEOL52 V1.0/ V2.1/ V3.0/ V3.1 MEBES RETICLE/ MODE5 Hitachi HL800/ HL900/ HL7000 Toshiba/NuFlare Tech. VSB11/ VSB12
Multi-platform Support
The following platforms are supported.
The machines of different architectures may be used to configure a cluster.
Sun SPARC Solaris 9, 10 (64-bit)
RedHat Enterprise Linux WS/ES/AS 3, 4
User-friendly GUI
MaskStudio offers a GUI to display job entries and their progresses. Job statuses can easily and visually be checked on the screen making it possible to predict when will each job be complete and lets you schedule when to use the generated data in the subsequent process.In addition, since the RuleEditor to interactively create a rule file, which is a file required for conversion, is equipped with MaskStudio, various functions of MaskStudio can easily be used even from the first startup.
Huge and Complex Data Handling
MaskStudio divides data and compresses its size according to the specified output file format. Moreover, in order to handle large size files, compressed data can be processed without being expanded.
As process node continues to shrink, it is very important for fracturing systems to have both high-speed and accurate output performance. MaskStudio suppresses slivers that could lead to accuracy degradation from being generated by original sliver control technique.
MRC Function
MRC function that allows you to check to see if an e-beam converted from an OPCed data includes any manufacturing-related defects. The MRC may be performed separately, or in parallel with e-beam conversion and will prevent problems in the subsequent process from being occurred.