January 2004 - The new features of next-generation layout viewer, LAVIS were announced

TOOL Corporation has announced new features in its LAVIS, the next-generation layout viewer that supports multi-format and allows LSI layout data to be displayed at high speed. LAVIS has already been adopted and used as an essential tool by a number of major device manufacturers etc. since its release in September 2001.

The following new features will be released.
We have been improving the features of LAVIS so as to be used as a standard viewer for semiconductor designs and manufacturing processes since its release. And now we are supporting LEF/DEF format that allows you to use LAVIS as a fast front end for floor planning and P&R processes. Moreover, a new feature is added so that you can use LAVIS with the OPC tools of other companies allowing LAVIS to be used in a wide variety of processes.
In addition, many features have been improved such as the narrowing feature, which simplifies short analysis, of the Node-Trace function and the configuration of new Internet remote access environment.

LEF/DEF Viewing Function

This feature lets you input and display LEF/DEF data, which is used for P&R tool etc. , and search instance, cell and net etc.

Node-Trace Additional Function

In addition to the existing Node-Trace function, the new feature lets you perform node trace from multiple places, which enables more efficient error analysis, such as short to be done.

Internet Remote Access Function

In addition to the existing remote viewer feature, the new feature lets you access your data remotely using Tarantella. A large amount of data can be viewed and handled from remote places.

Compatibility with OPC Tools

You will be able to perform wafer image simulation using Prospector (Synopsys, Inc.) while displaying OPCed GDS data in LAVIS.
The output of this simulation is overlaid on GDS data so that you can perform interactive simulation even when the data is extremely large (simulation is performed in each specified area)


We will introduce these new features along with a demonstration at "Electronic Design and Solution Fair 2004" held at the end of January 2004.